In-Mold electronics paste (Thermo-formable Ag Paste)
Product
In-Mold electronics paste (Thermo-formable Ag Paste)
Product ID: Paron-970
This conductive paste is
Designed as a screen printing conductive paste for flexible printed
Designed as withstand the intense stretching and heat of the thermoforming.
Specifications:
|
Item |
Unit |
Paron-970 |
|
|
Paste properties |
Solid Content |
wt% |
60 ± 5 |
|
Viscosity* |
cps |
15,000 ± 3,000 |
|
|
FOG |
㎛ |
≤ 5.0 |
|
|
Specific Gravity |
g/cc |
2.5±0.3 |
|
|
Physical Properties |
Surface resistivity ** |
mΩ/□ |
≤ 100 |
|
Resistivity after Thermoforming |
mΩ/□ |
≤ 100 |
|
|
Pencil Hardness |
H |
≥ H |
|
|
Cross-hatch cut |
B |
5 |
|
Features:
- Good printing characteristics.
- High conductivity and good wear resistance characteristics.
- Excellent adhesion to polycarbonate and PET film.
- Excellent performance after thermoforming.
- Excellent flexibility.
